The difference between atmospheric pressure plasma cleaning machine and vacuum plasma cleaning machine!

Low pressure plasma cleaning technology can be used for activation and binding in microfluidic device manufacturing. Low pressure plasma has many advantages, and low pressure plasma cleaning and activation technology has advantages in control. This is because it is easy to change key process settings in automatic low-pressure plasma systems.

Low pressure plasma gas is relatively easy to control each of these process variables by changing the program process control variables based on settling time, pressure, gas flow rate, power, and exhaust. It is usually impossible to control key process parameters such as pressure, gas flow rate, and power in atmospheric plasma sources because these parameters are locked in the atmospheric plasma source to generate stable and reproducible atmospheric plasma reactions.

The following are significant differences between atmospheric pressure plasma cleaning machines and vacuum plasma cleaning machines in terms of working principles, application scenarios, and processing effects:

1. Working principle

Atmospheric pressure plasma cleaning equipment: using the cleaning activity and high energy of plasma to clean impurities on the surface of objects, injecting gas (such as air or nitrogen) into the nozzle to form plasma under the action of a high-voltage electric field.

High energy electrons in plasma will collide with oxygen molecules, forming oxygen ions and free radicals, and react with water molecules to generate hydroxyl radicals and hydrogen ions. These ions and free radicals have strong redox abilities and can oxidize and decompose organic substances on the surface of objects.

Vacuum plasma cleaning equipment: Stimulate gases (such as oxygen, argon, or nitrogen) in a vacuum environment to generate high-energy plasma. These plasmas are composed of ions, electrons, and active free radicals, and can undergo physical bombardment or chemical reactions with organic pollutants or oxides on the surface of materials.

2. Application scenarios

Atmospheric pressure plasma cleaning machine: mainly suitable for processing materials with relatively flat surfaces, such as activation treatment of mobile phone glass surface, pre-treatment of bottom plate glue, front-end treatment of packaging, activation treatment of mobile phone case surface before painting, etc. Suitable for rapid mass production, it can achieve continuous operation on the assembly line, and the processing process is simpler and more feasible.

Vacuum plasma cleaning machine: capable of processing more complex and non high temperature resistant materials, such as difficult to handle parts such as the inner walls of conduits. Widely used in high-end manufacturing fields such as semiconductor manufacturing, medical industry, optical components, electronic products, and automotive industry.

3. Processing effect

Atmospheric pressure plasma treatment machine: The cleaning effect is good, but mainly for surface treatment, and the cleaning effect is limited for complex shapes or internal structures. The temperature is relatively high, so when processing materials, it is important to avoid prolonged periods of inactivity towards a specific point to prevent surface burning.

Vacuum plasma processing machine: The processing effect is more precise and comprehensive, and it can partially clean the overall, local or complex structure of materials. Low temperature, suitable for handling materials that are prone to deformation when heated.

4. Gas usage

Atmospheric pressure plasma cleaning machine: Only compressed air needs to be connected during operation, but for better results, nitrogen can be directly connected.

Vacuum plasma cleaning machine: There are more choices in gas, and multiple gases can be selected for matching, which greatly improves the removal of surface oxides and nanoscale microorganisms on materials.

Summary: Both atmospheric pressure plasma cleaning machines and vacuum plasma cleaning machines have their own advantages and disadvantages. The choice of equipment depends on specific application and process requirements. If you need to quickly process materials with relatively flat surfaces, atmospheric plasma cleaning machines are a better choice; If you need to perform fine or biomedical surface cleaning on complex shapes or materials that are not resistant to high temperatures, a vacuum plasma cleaning machine is more suitable. If you don't know 

how to choose, you can consult our technical personnel at Zhenyi Co., Ltd. to provide some reference opinions for you.