Why plasma cleaning machines are so popular in the semiconductor industry!

Plasma cleaning technology can use plasma to remove surface residues such as residual photoresist, organic impurities, etc., in order to improve wire bonding and etching processes, ensuring high-quality and reliable equipment.

What is plasma cleaning? Plasma cleaning technology involves exposing the surface to plasma, which is an ionized gas containing free electrons, ions, and neutral particles. This plasma interacts with the surface and uses high-energy ions and reactive groups to remove pollutants.

What is the effect of plasma cleaning treatment before semiconductor packaging?

Low temperature plasma cleaning technology can effectively remove organic residues, oxides, and other impurities in processes such as wire bonding, etching, and deposition, which may have a negative impact on the reliability and performance of equipment.

By cleaning the surface and possibly activating the treatment, plasma cleaning machines can promote better adhesion of materials in subsequent processes. By removing pollutants and improving surface quality, plasma cleaning can help increase production.

The vacuum plasma cleaning machine can effectively remove organic substances such as photoresist, polymer residues, and grease on the surface of semiconductors. If these organic substances are not removed, they will affect the deposition, etching, and other effects of materials in subsequent processes. For example, residual photoresist can cause poor contact between metal electrodes and semiconductor surfaces, affecting current transmission.

Vacuum plasma cleaning also has a good removal effect on inorganic impurities such as metal ions and oxides remaining on the surface of semiconductors. For example, the natural oxide layer on the surface of silicon wafers can be removed by vacuum plasma cleaning, providing a clean surface for the growth of high-quality oxide layers and ensuring the stability of the device's electrical performance.

The interaction between plasma and semiconductor surface can put surface atoms in a higher energy state, increase surface performance, which is beneficial for better adhesion between the film material and the semiconductor surface during subsequent film deposition, improve film adhesion, reduce film detachment and other problems, and enhance the stability of device structure.

Generate a large amount of activity on the surface of semiconductors, promoting the progress of chemical reactions. For example, plasma cleaning before chemical vapor deposition (CVD) can generate more active silicon atoms on the surface of silicon wafers, which are more likely to react with reactive gases in the gas phase, thereby improving deposition rate and film quality.

After plasma cleaning treatment, impurities on the semiconductor surface are removed, the activity is improved, and the electrical performance of the device is optimized. For example, in transistor manufacturing, leakage current can be reduced, switching speed and current driving capability can be improved, thereby enhancing the operating speed and stability of the entire integrated circuit.

The vacuum plasma cleaning machine can make semiconductor devices more stable during long-term use, reduce performance degradation and short circuits caused by surface impurities and poor interfaces, and improve the reliability and service life of the devices.

In chip packaging, plasma cleaning machines can be used to remove organic matter, oxides, and impurities from the wafer surface, ensuring uniform coating of photoresist and precise transfer of lithography patterns. After the etching process, residual photoresist and polymers are removed. During chip packaging, plasma cleaning and activation are performed on lead frames, bonding pads, etc. to improve bonding strength and packaging reliability.