How effective is the atmospheric plasma cleaning machine in cleaning flexible circuit boards?

In the field of chip production, low-temperature plasma cleaning machine processing of integrated circuit chips and their packaging carriers can not only achieve ultra purification treatment of the welding process surface, but also greatly improve the activity of the welding process surface, effectively avoid empty welding, reduce faults and holes, improve the

 reliability of the welding process, and at the same time, increase the relative height and inclusiveness of the outer edge of the filling material, effectively improve the mechanical strength of the packaging, reduce the internal power generated between surfaces due to the thermal expansion coefficient of different materials, and improve the reliability and service life of the product.

Today, let's talk in detail about the application process of atmospheric plasma processors in surface treatment of flexible circuit boards!

In the field of new energy, alloy copper materials with excellent heat transfer, conductivity, and production performance indicators are mainly used as flexible circuit boards. Copper oxides and many other organic chemical pollutants can cause sealing molding and segmentation of copper flexible circuit boards, resulting in a decrease in sealing performance indicators and chronic ventilation problems after packaging. At the same time, it can also affect the quality of integrated circuit wafer bonding and wire bonding products. Ensuring the ultra cleanliness of flexible circuit boards is the key to ensuring packaging reliability and qualification rate.

Using an atmospheric plasma cleaning machine for cleaning treatment can remove organic matter from drilled holes, greatly improving the quality of coating products.

The plasma cleaning effect on the surface of the circuit board is significant, with improved surface cleanliness, hydrophilicity, and adhesion. The detailed significant effects are as follows:

Plasma cleaning can effectively remove inorganic impurities such as grease, photoresist residue, fingerprints, and organic contaminants on the surface of circuit boards such as metal oxides. This is because high-energy particles in the plasma undergo physical and chemical reactions with pollutants, decomposing or converting into volatile substances, thereby thoroughly cleaning the surface.

1. Improving surface hydrophilicity: After plasma cleaning, the hydrophilicity of the circuit board surface will be significantly improved. When the plasma interacts with the surface, polar groups such as hydroxyl and carboxyl groups will be introduced into the surface, which increases the wettability of the surface and facilitates subsequent coating and soldering processes. For example, good hydrophilicity during the welding process helps to better lay solder and improve welding quality.

2. Enhance surface adhesion: Atmospheric plasma cleaning machine can make the surface of the circuit board micro rough, increase surface area, and improve surface energy. This is beneficial for the subsequent coating and film to better bond with the surface of the circuit board. For example, when coating the solder mask layer, the surface after plasma cleaning has a stronger bonding force with the solder mask material, which can effectively prevent the solder mask layer from falling off and improve the reliability of the circuit board.

In short, plasma cleaning is a dry treatment method that can accurately control the treatment area and degree, avoiding the liquid residue and impact on the surrounding area that may be caused by traditional wet cleaning. Plasma cleaning equipment can thoroughly clean and activate complex structures such as small holes and gaps on circuit boards to ensure uniform surface treatment.