Dow corning SE9184 is a white, medium heat resistant single unit room temperature curing silica gel, no oven and solvent in curing process, no ventilation.
Short in the short run time, we can improve the speed of online processing by means of SE9184.
The solidification can also be accelerated by heating and not flowing after it is applied.
Tao corning SE9184 is refined and low volatility, reducing the volatiles that may affect the surrounding parts.
Product features
It has both adhesion and good heat conduction and heat dissipation
Neutral solidification, no corrosion to most metal
Excellent anti-heat transfer performance, aging resistance and electrical insulation
The rubber layer has excellent moisture-proof, aseismatic, corona and leakage resistance
Fully comply with eu ROHS directive requirements
UL 94v-0 flame retardant class.
Application scenarios
The filling and bonding between the cpus and the radiator, the thyristor control module and the radiator, the power and the radiators are replaced by the channel corning SE9184.
This adhesive can be used without the traditional card and screw, the process is simple and convenient.
The performance parameters
Method of use
Clean surface: it is cleaned by the surface of the sticky substance, ensuring that the surface is dry, no oil, no dust.
Glue: apply glue to the adhesive surface and press together.
Solidification: dry 24-120 hours to ensure maximum adhesion strength.
Professional adhesive technology solution please click for consultation
Dow corning SE9184 conductive adhesive for the purchase of links：
https://detail.1688.com/offer/523254864137.html? SPM = a2615.7691456.0.0.3 X0vFY
